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Are you paying unnecessary initial costs in substrate manufacturing?

Significant cost reductions are possible in small lot manufacturing of flexible printed circuit boards! We also support medium lot manufacturing.

Our company has achieved coverlay processing and contour processing of flexible substrates using our unique know-how with lasers. As a result, we can significantly shorten the manufacturing lead time for flexible substrates and reduce initial costs substantially through "no mold cost." It is also possible to perform corrections for each substrate, ensuring very high processing precision. [Overview] ■ Significant cost reduction through laser processing ■ Supports medium lot production of flexible substrates *For more details, please refer to the PDF document or feel free to contact us.

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